? semiconductor components industries, llc, 2011 january, 2011 ? rev. 3 1 publication order number: murd530/d murd530 switchmode power rectifier dpak surface mount package these state ? of ? the ? art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. features ? ultrafast 50 nanosecond recovery time ? low forward voltage drop ? low leakage ? pb ? free package is available mechanical characteristics ? case: epoxy, molded ? weight: 0.4 gram (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds ? available in 16 mm tape and reel, 2500 units per reel, by adding a ?t4?? suffix to the part number maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 300 v average rectified forward current (rated v r , t c = 165 c) i f(av) 5.0 a peak repetitive forward current (rated v r , square wave, 20 khz, t c = 165 c) i frm 10 a non ? repetitive peak surge current (surge applied at rated load conditions halfwave, 60 hz) i fsm 75 a operating junction and storage temperature range t j , t stg ? 65 to +175 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. ultrafast rectifier 5.0 amperes, 300 volts 4 1 3 http://onsemi.com dpak case 369c marking diagram a = assembly location y = year ww = work week g = pb ? free package 1 2 3 4 ayww u 530g device package shipping ? ordering information murd530t4g dpak (pb ? free) 2500/tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d.
murd530 http://onsemi.com 2 thermal characteristics rating symbol value unit thermal resistance ? junction ? to ? case (note 1) r jc 3 c/w thermal resistance ? junction ? to ? ambient (note 2) r ja 92 c/w thermal resistance ? junction ? to ? ambient (note 3) r ja 57 c/w electrical characteristics maximum instantaneous forward voltage drop (note 4) (i f = 3 a, t j = 25 c) (i f = 3 a, t j = 125 c) (i f = 5 a, t j = 25 c) (i f = 5 a, t j = 125 c) v f 0.95 0.80 1.05 0.90 volts maximum instantaneous reverse current (note 4) (t j = 25 c, rated dc voltage) (t j = 125 c, rated dc voltage) i r 5.0 150 a maximum reverse recovery time (i f = 1 amp, di/dt = 50 a/ s, v r = 30 v, t j = 25 c) t rr 50 ns 1. rating applies for one diode leg. 2. rating applies when for both diode legs when mounted on 130 mm 2 pad size. 3. rating applies for both diode legs when mounted on 1 in pad size. 4. pulse test: pulse width = 300 s, duty cycle 2.0%. 0 0.001 0.01 0.1 1.0 10 100 1000 0 50 100 150 200 250 300 0.1 1 10 100 0 0.5 1.0 1.5 2.0 figure 1. maximum forward voltage v f, instantaneous voltage (v) i f , forard current (a) t j = 175 c 25 c ? 40 c figure 2. typical forward voltage v f, instantaneous voltage (v) i f , forard current (a) 175 c 25 c 85 c 125 c ? 40 c figure 3. maximum reverse voltage v r , reversee voltage (v) i r , reverse current ( a) 125 c 25 c ? 40 c figure 4. typical reverse voltage v r , reversee voltage (v) i r , reverse current (a) 175 c 125 c 85 c 25 c ? 40 c 85 c 125 c 0.1 1 10 100 0 0.5 1.0 1.5 2.0 175 c 85 c 0 0.001 0.01 0.1 1.0 10 100 1000 0 50 100 150 200 250 300
murd530 http://onsemi.com 3 figure 5. typical current derating, case t c , case temperature ( c) i f , average forward current ( a) dc square wave figure 6. typical current derating, ambient t a , ambient temperature ( c) i f , average forward current ( a) dc square wave figure 7. forward power dissipation i o , average forward current (a) p fo , average power dissipation (w) dc square wave c, capacitance (pf) figure 8. typical capacitance v r , reverse voltage (v) 0 80 90 100 110 120 130 140 150 160 170 1 8 5 rated voltage applied r ja = 57 c/w 0 5 10 15 80 90 100 110 120 130 140 150 160 170 180 rated voltage applied r ja = 3 c/w 0 1 2 3 4 5 6 7 8 0123456789 1 10 100 1000 t j = 25 c 0 50 100 250 200 150 0.01 0.1 1 10 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 r (t) , ( c/w) figure 9. r (t) on an infinite heatsink power (j1) 0.800 w power (j2) 0.800 w pulse time (s) d = 0.5 0.2 0.1 0.05 0.01 single pulse
murd530 http://onsemi.com 4 0.001 0.01 0.1 1 10 100 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 r (t) , ( c/w) figure 10. pcb cu area 650 mm 2 pcb cu thk 1 oz power (j1) 0.800 w power (j2) 0.800 w pulse time (s) d = 0.5 0.2 0.1 0.05 0.01 single pulse
murd530 http://onsemi.com 5 package dimensions dpak (single gauge) case 369c ? 01 issue d b d e b3 l3 l4 b2 e m 0.005 (0.13) c c2 a c c z dim min max min max millimeters inches d 0.235 0.245 5.97 6.22 e 0.250 0.265 6.35 6.73 a 0.086 0.094 2.18 2.38 b 0.025 0.035 0.63 0.89 c2 0.018 0.024 0.46 0.61 b2 0.030 0.045 0.76 1.14 c 0.018 0.024 0.46 0.61 e 0.090 bsc 2.29 bsc b3 0.180 0.215 4.57 5.46 l4 ??? 0.040 ??? 1.01 l 0.055 0.070 1.40 1.78 l3 0.035 0.050 0.89 1.27 z 0.155 ??? 3.93 ??? notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: inches. 3. thermal pad contour optional within di- mensions b3, l3 and z. 4. dimensions d and e do not include mold flash, protrusions, or burrs. mold flash, protrusions, or gate burrs shall not exceed 0.006 inches per side. 5. dimensions d and e are determined at the outermost extremes of the plastic body. 6. datums a and b are determined at datum plane h. 12 3 4 5.80 0.228 2.58 0.102 1.60 0.063 6.20 0.244 3.00 0.118 6.17 0.243 mm inches scale 3:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* h 0.370 0.410 9.40 10.41 a1 0.000 0.005 0.00 0.13 l1 0.108 ref 2.74 ref l2 0.020 bsc 0.51 bsc a1 h detail a seating plane a b c l1 l h l2 gauge plane detail a rotated 90 cw on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. murd530/d publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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